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Cambridge Graphene Centre

Research Centre on Graphene, Layered Crystals and Hybrid Nanomaterials
 

Below, you can find the list of equipment available in Class 1000 Cleanroom. A few are already available for use, others are being installed and will become available later.

Please use the booking system to use the equipment.

 

Plasma-Enhanced Chemical Vapour Deposition system (PE-CVD)

Model: Vision 310, Advanced Vacuum AB

To be available in 2020

Used for plasma-enhanced chemical vapour deposition system is used for depositing amorphous Si, SiO2 and Si3N4.
Gases connected: SiH4, NH3, N2O, N2

Users in charge:

Dr Yury Alaverdyan

Lee Robinson

 

 

 

 

Reactive Ion Etcher (RIE-AV)

Model: Vision 320, Advanced Vacuum AB

Used for reactive-ion etching of Si, SiO2 and Si3N4.
Gases connected: SF6, CHF3, C4F8, CF4, O2, Ar, N2
Compatible only with the following substrate/mask materials:
Si, Al, PR, SiO2, Si3N4 (exposed noble metal parts/masks are not allowed)

 

Users in charge:

Dr Abdulaziz Almutairi

Lee Robinson

 

Inductively-Coupled Reactive Ion Etcher (RIE-ICP-AV)

Model: APEX SLR, Advanced Vacuum AB

A load-locked system for inductively-coupled reactive-ion etching of Si, SiO2 and Si3N4 with an enhanced rate and anisotropicity.
Gases connected: SF6, CHF3, C4F8, CF4, O2, Ar, N2
Compatible only with the following substrate/mask materials:
Si, Al, PR, SiO2, Si3N4 (exposed noble metal parts/masks are not allowed)

 

Users in charge:

Dr Abdulaziz Almutairi

Lee Robinson

 

Inductively-Coupled Reactive Ion Etcher (RIE-ICP-OX)

Model: PlasmaLab 100, Oxford Instruments

A load-locked system for inductively-coupled reactive-ion etching of Si, SiO2 and Si3N4 with an enhanced rate and anisotropicity.
Gases connected: SF6, CHF3, C4F8, CF4, O2, Ar, N2
Compatible only with the following substrate/mask materials:
Si, Al, PR, SiO2, Si3N4 (exposed noble metal parts/masks are not allowed)

 

Users in charge:

Dr Yury Alaverdyan

Lee Robinson

 

Reactive Ion Etcher (RIE-Nano)

Model: NanoEtch, Moorfield Nanotechnology Ltd

The tool implements a unique soft-etching technology and provides the fine etching control crucial for graphene and 2D materials research in a convenient, benchtop package.
Gases available: O2, Ar, N2

Users in charge:

Dr James Kerfoot

Sputter-Coater (Spuco)

Model: NanoPVD, Moorfield Nanotechnology Ltd

The bench-top system for sputter deposition of thin metal and dielectric films.

Materials: Au, Ni, Cr, SiO2. Others available upon request.

Gases connected: O2, Ar, N2

Users in charge:

Lee Robinson

Plasma Cleaner (RIE-Femto)

Model: Femto, Diener Electronics GmbH.

This is a low-pressure plasma system used for plasma cleaning of substrates and activating surfaces.

Gases connected: O2, N2

 

Users in charge:

Lee Robinson

Electron-beam Evaporator (Evap-LEV)

Model: PVD 200 Pro, Kurt J. Lesker

This PVD tool is used for e-beam evaporation and sputter deposition of metals dielectrics.
Materials: Au, Cr, Ti, Al, SiO2, Al2O3

Users in charge:

Lee Robinson

 

Electron-beam Evaporator (Evap-IndEV)

Model: Nexdep, Angstrom Engineering

This PVD tool is used for low-melting point metals as well as general materials for contacts' deposition.


Materials: In, Au, Pt, Pd, Ti 

Users in charge:

Yan Wang

Lee Robinson

 

Nexdep

Thermal Evaporator (Evap-TEV)

Model: MiniLab 60, Moorfield Nanotechnology Ltd

Manual and Automatic process modes, HMI, used for a thermal evaporation of selected metals (please inquire).

 

Users in charge:

Lee Robinson

Plasma-Enhanced Atomic Layer Deposition (PE-ALD)

To Be Installed in Feb 2021

Model: Fiji, Veeco

Used for Plasma-Enhanced Atomic Layer Deposition of Al2O3, TiO2HfO2

 

Users in charge:

Lee Robinson

Atomic Layer Deposition (ALD)

Model: TFS200, Beneq

Used for Atomic Layer Deposition of Al2O3 and TiO2.

Materials: liquid TMA and TiCl4 precursors

 

Users in charge:

Dr Yang Li

Lee Robinson

Ar-filled Glovebox (Evap-GB + Robot-GB)

Model: M-Braun

Inert-atmosphere (Ar) glovebox with a robotized 3D graphene transfer system and a thermal evaporator. The thermal evaporator can be accessed from the inside as well as outside of the glovebox. There is a spinner and a hotplate inside.

Users in charge:

Dr James Kerfoot

 

Graphene Chemical Vapour Deposition (CVD-G)

Model: Graphene Square

This chemical vapor deposition system is used to produce  graphene films.

 

Users in charge:

Dr Osman Balci

Dr Sachin Shinde

Transition-Metal Dichalcogenides Chemical Vapour Deposition (CVD-TMD)

Model: Planartech

A Dual-Furnace Chemical Vapour Deposition system for growth of 2D transition-metal dichalcogenides (WSe2).

 

Users in charge:

Dr Sachin Shinde

Dr Osman Balci

Plasma-Enhanced Graphene Chemical Vapour Deposition (CVD-PE-G)

Model: Planartech

Plasma-Enhanced Chemical Vapour Deposition system for growth of high-quality graphene.

 

Users in charge:

Dr Osman Balci

Dr Sachin Shinde

Boron-Nitride Chemical Vapour Deposition (CVD-BN)

Model: Planartech

h-BN Chemical Vapour Deposition system for growth of Boron Nitride films.

Users in charge:

Dr Osman Balci

Dr Sachin Shinde

CVD-BN

Graphene Transfer Systems x2

Model: Nikon

The tool is equipped with micro-manipulators and is based on Nikon Eclipse microscope

 

Users in charge:

Dr James Kerfoot

Tube Furnaces - x3

Model: MTI GTF-1200X 

 

Users in charge:

Dr Sachin Shinde

Acid Bench

This wetbench is used for graphene transfer, cleaning, and a number of other processes involving acids.

 

Users in charge:

Dr Yury Alaverdyan

Solvent Bench

This wetbench is used for cleaning, preparation of samples for deposition, etching, as well as any other operations requiring solvents.

 

Users in charge:

Dr Yury Alaverdyan