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Cambridge Graphene Centre

Research Centre on Graphene, Layered Crystals and Hybrid Nanomaterials

Studying at Cambridge

 

CGC Class 1000 Cleanroom

Below, you can find the list of equipment available in Class 1000 Cleanroom. A few are already available for use, others are being installed and will become available later.

Please use the booking system to use the equipment.

 

Plasma-Enhanced Chemical Vapour Deposition system (PE-CVD)

Model: Vision 310, Advanced Vacuum AB

To be available in Nov 2019

Used for plasma-enhanced chemical vapour deposition system is used for depositing amorphous Si, SiO2 and Si3N4.
Gases connected: SiH4, NH3, N2O, N2

Users in charge:

Dr Yury Alaverdyan - ya236

 

 

 

 

Reactive Ion Etcher (RIE-AV)

Model: Vision 320, Advanced Vacuum AB

Used for reactive-ion etching of Si, SiO2 and Si3N4.
Gases connected: SF6, CHF3, C4F8, CF4, O2, Ar, N2
Compatible only with the following substrate/mask materials:
Si, Al, PR, SiO2, Si3N4 (exposed noble metal parts/masks are not allowed)

 

Users in charge:

Dr Gyeong Park - gp440

Dr Yury Alaverdyan - ya236

Additional documents:

- User Manual

Risk Assessment

Inductively-Coupled Reactive Ion Etcher (RIE-ICP-AV)

Model: APEX SLR, Advanced Vacuum AB

A load-locked system for inductively-coupled reactive-ion etching of Si, SiO2 and Si3N4 with an enhanced rate and anisotropicity.
Gases connected: SF6, CHF3, C4F8, CF4, O2, Ar, N2
Compatible only with the following substrate/mask materials:
Si, Al, PR, SiO2, Si3N4 (exposed noble metal parts/masks are not allowed)

 

Users in charge:

Dr Gyeong Park - gp440

Dr Yury Alaverdyan - ya236

Additional documents:

- User Manual

Risk Assessment

Inductively-Coupled Reactive Ion Etcher (RIE-ICP-OX)

Model: PlasmaLab 100, Oxford Instruments

A load-locked system for inductively-coupled reactive-ion etching of Si, SiO2 and Si3N4 with an enhanced rate and anisotropicity.
Gases connected: SF6, CHF3, C4F8, CF4, O2, Ar, N2
Compatible only with the following substrate/mask materials:
Si, Al, PR, SiO2, Si3N4 (exposed noble metal parts/masks are not allowed)

 

Users in charge:

Dr Yury Alaverdyan - ya236

 

Reactive Ion Etcher (RIE-Nano)

Model: NanoEtch, Moorfield Nanotechnology Ltd

The tool implements a unique soft-etching technology and provides the fine etching control crucial for graphene and 2D materials research in a convenient, benchtop package.
Gases connected: CF4, O2, Ar, N2

Users in charge:

Dr Alisson Cadore - arc87

Sputter-Coater (Spuco)

Model: NanoPVD, Moorfield Nanotechnology Ltd

The bench-top system for sputter deposition of thin metal and dielectric films.

Materials: Au, Ni, Cr, SiO2. Others available upon request.

Gases connected: O2, Ar, N2

Users in charge:

Ms Hannah Watson - hfyw2


Plasma Cleaner (RIE-Femto)

Model: Femto, Diener Electronics GmbH.

This is a low-pressure plasma system used for plasma cleaning of substrates and activating surfaces.

Gases connected: O2, N2

 

Users in charge:

Dr Yury Alaverdyan - ya236

Electron-beam Evaporator (Evap-LEV)

Model: PVD 200 Pro, Kurt J. Lesker

This PVD tool is used for e-beam evaporation and sputter deposition of metals dielectrics.
Materials: Au, Cr, Ti, Al, SiO2, Al2O3

 

Users in charge:

Dr Victor Serdio - vs449

Mr Giuseppe Russo 

 

Thermal Evaporator (Evap-TEV)

Model: MiniLab 60, Moorfield Nanotechnology Ltd

Features: Manual and Automatic process modes, HMI, used for a thermal evaporation of selected metals.
Materials: Au, Ag, Cr, Al

 

Users in charge:

Ms Hannah Watson - hfyw2

Dr Wenshan Li - wl364

Atomic Layer Deposition (ALD)

Model: TFS200, Beneq

Used for Atomic Layer Deposition of Al2O3 and TiO2.

Materials: liquid TMA and TiCl4 precursors

 

Users in charge:

Mr Yang Li - yl539

Ar-filled Glovebox (Evap-GB + Robot-GB)

Model: M-Braun

Inert-atmosphere (Ar) glovebox with a robotized 3D graphene transfer system and a thermal evaporator. The thermal evaporator can be accessed from the inside as well as outside of the glovebox. There is a spinner and a hotplate inside.

Users in charge:

Dr Alisson Cadore - arc87

Dr Ioannis Paradeisanos - ip351

Graphene Chemical Vapour Deposition (CVD-G)

Model: Graphene Square

This chemical vapor deposition system is used to produce  graphene films.

 

Users in charge:

Dr Osman Balci - ob325

Dr Prasana Sahoo - pks45

Transition-Metal Dichalcogenides Chemical Vapour Deposition (CVD-TMD)

Model: Planartech

A Dual-Furnace Chemical Vapour Deposition system for growth of 2D transition-metal dichalcogenides (WSe2).

 

Users in charge:

Dr Osman Balci - ob325

Dr Prasana Sahoo - pks45

Plasma-Enhanced Graphene Chemical Vapour Deposition (CVD-PE-G)

Model: Planartech

Plasma-Enhanced Chemical Vapour Deposition system for growth of high-quality graphene.

 

Users in charge:

Dr Osman Balci - ob325

Dr Prasana Sahoo - pks45

Boron-Nitride Chemical Vapour Deposition (CVD-BN)

Model: Planartech

BN Chemical Vapour Deposition system for growth of Boron Nitride films.

Users in charge:

Dr Osman Balci - ob325

Dr Prasana Sahoo - pks45

CVD-BN

Graphene Transfer Systems x2

Model: Nikon

The tool is equipped with micro-manipulators and is based on Nikon Eclipse microscope

 

Users in charge:

Dr Alisson Cadore - arc87

Dr Ioannis Paradeisanos - ip351

Tube Furnaces - x3

Model: MTI GTF-1200X 

 

Users in charge:

Dr Yury Alaverdyan - ya236

Acid Bench

This wetbench is used for graphene transfer, cleaning, and a number of other processes involving acids.

 

Users in charge:

Dr Yury Alaverdyan - ya236

Solvent Bench

This wetbench is used for cleaning, preparation of samples for deposition, etching, as well as any other operations requiring solvents.

 

Users in charge:

Dr Yury Alaverdyan - ya236